APPARATUS AND METHOD FOR ESTIMATING THE DEPTH OF THE BURIED DEFECT IN THE SUBSTRATE
摘要
<p>Provided are an apparatus and a method for estimating a depth of a buried defect in a substrate. The apparatus for estimating a depth of a buried defect in a substrate includes a light source providing a source of light; an aperture through which only a part of the source of light passes; a reflecting mirror receiving and reflecting the source of light that has passed through the aperture as a first light; a lens receiving and condensing the first light; the substrate receiving and reflecting the condensed first light as a second light; a light sensor receiving the second light and sensing a brightness of the second light; and a position adjustment portion adjusting a distance between the lens and the substrate.</p>
申请公布号
KR20140114169(A)
申请公布日期
2014.09.26
申请号
KR20130028674
申请日期
2013.03.18
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
SUN, JONG CHEON;AHN, JEONG HO;LEE, DONG RYUL;IHM, DONG CHUL