发明名称 |
LED CHIPS ARRAY MODULE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A method of manufacturing an LED chips array module comprises the steps of forming a primer layer by printing an adhesive material on a base; forming a circuit pattern layer by printing a conductive material on the primer layer along a constant pattern; and mounting a plurality of LED chips on the circuit pattern layer. |
申请公布号 |
KR20140114091(A) |
申请公布日期 |
2014.09.26 |
申请号 |
KR20130028401 |
申请日期 |
2013.03.18 |
申请人 |
EXAX INC. |
发明人 |
LEE, HYUN MI;HEO, SOON YEONG;HAN, SEUNG JUN |
分类号 |
H01L33/62;H01L33/48 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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