发明名称 LED CHIPS ARRAY MODULE AND METHOD OF MANUFACTURING THE SAME
摘要 A method of manufacturing an LED chips array module comprises the steps of forming a primer layer by printing an adhesive material on a base; forming a circuit pattern layer by printing a conductive material on the primer layer along a constant pattern; and mounting a plurality of LED chips on the circuit pattern layer.
申请公布号 KR20140114091(A) 申请公布日期 2014.09.26
申请号 KR20130028401 申请日期 2013.03.18
申请人 EXAX INC. 发明人 LEE, HYUN MI;HEO, SOON YEONG;HAN, SEUNG JUN
分类号 H01L33/62;H01L33/48 主分类号 H01L33/62
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