发明名称 |
DOUBLE-SIDE POLISHING METHOD |
摘要 |
<p>The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at the same time, the method including the steps of: first polishing at a high polishing rate; second polishing at a low polishing rate; measuring flatness of the polished wafer; and determining polishing conditions of the second polishing in a next polishing batch on a basis of the measured flatness. The method can stably improve the flatness of a wafer without being affected by variations in carrier thickness over time.</p> |
申请公布号 |
SG11201401560V(A) |
申请公布日期 |
2014.09.26 |
申请号 |
SG11201401560V |
申请日期 |
2012.10.04 |
申请人 |
SHIN-ETSU HANDOTAI CO.,LTD. |
发明人 |
AOKI, KAZUAKI;OBA, SHIGERU |
分类号 |
B24B37/08;B24B49/10;B24B49/12;H01L21/304 |
主分类号 |
B24B37/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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