| 摘要 |
<p>A polishing pad for chemical mechanical polishing includes at least a polishing layer whose polishing surface includes a first groove and a second groove, the first and second grooves have side surfaces, which are continuous with the polishing surface, on each edge in a groove width direction, the first groove has an angle of larger than 105 degrees and 150 degrees or smaller, which is formed between the polishing surface and the side surface continuous with the polishing surface, on at least one edge in the groove width direction, and the second groove has an angle of 60 degrees or larger and 105 degrees or smaller, which is formed between the polishing surface and the side surface continuous with the polishing surface, on both of two edges in the groove width direction.</p> |
