发明名称 DEVICE AND METHOD FOR PROCESSING SUBSTRATE
摘要 The present invention is to instantly dry the liquid on the surface during drying of a substrate and to improve the productivity of the substrate. A substrate processing apparatus (100) comprises: a cleaning liquid supply unit (114) for supplying a cleaning liquid to a surface of a substrate (W); a solvent supply unit (115) for supplying a volatile solvent to the surface of the substrate (W), in which the cleaning liquid is supplied, to substitute the cleaning liquid on the surface of the substrate (W) with the volatile solvent; a heating means (117) for heating the substrate (W) in which the volatile solvent is supplied; and a drying means (118) for drying the surface of the substrate (W) by removing the droplets of the volatile solvent generated on the surface of the substrate (W) by the heating operation due to the heating means (117). The heating means (117) and the drying means (118) are provided in the course of returning the substrate (W) taken out from the solvent supply unit (115).
申请公布号 KR20140114301(A) 申请公布日期 2014.09.26
申请号 KR20140031020 申请日期 2014.03.17
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 HAYASHI KONOSUKE;FURUYA MASAAKI;OOTAGAKI TAKASHI;NAGASHIMA YUJI;KINASE ATSUSHI;ABE MASAHIRO
分类号 H01L21/302;H01L21/324;H01L21/677 主分类号 H01L21/302
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