| 主权项 |
1. A semiconductor module comprising:
a first lead frame; a second lead frame; a third lead frame; a first switching element including a first electrode and a second electrode; a second switching element including a first electrode and a second electrode; a snubber circuit including at least one element; and a resin portion configured to seal the first lead frame, the second lead frame, the third lead frame, the first switching element, the second switching element, and the snubber circuit, wherein: the first electrode of the first switching element is connected to the first electrode of the second switching element via the first lead frame; the second electrode of the first switching element is connected to the element of the snubber circuit via the second lead frame; the second electrode of the second switching element is connected to the element of the snubber circuit via the third lead frame; a first surface of the second lead frame and a first surface of the third lead frame are placed on a same plane; an end face of the second lead frame is opposed to an end face of the third lead frame; a first gap is formed between the end face of the second lead frame and the end face of the third lead frame; the element of the snubber circuit is placed over the end face of the second lead frame and the end face of the third lead frame; a first portion of the element of the snubber circuit is joined to the first surface of the second lead frame and a second portion of the element of the snubber circuit is joined to the first surface of the third lead frame; and the resin portion has a slit extending from an outer surface of the resin portion to an inside of the first gap between the end face of the second lead frame and the end face of the third lead frame. |
