| 发明名称 |
CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME |
| 摘要 |
A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b. |
| 申请公布号 |
US2014284088(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201214354600 |
申请日期 |
2012.09.28 |
| 申请人 |
KYOCERA Corporation |
发明人 |
Nakamura Kiyotaka;Ohashi Yoshio;Shikata Kunihide |
| 分类号 |
H05K1/09 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board comprising a ceramic sintered body and a metal wiring layer disposed on at least one principal surface of the ceramic sintered body, wherein the metal wiring layer includes a first region which is in contact with the principal surface and which contains a glass component and a second region which is located on the first region and which does not contain a glass component, the thickness of the first region is 35% or more and 70% or less of the thickness of the metal wiring layer, and the average grain size of a metal in the first region is smaller than the average grain size of a metal in the second region. |
| 地址 |
Kyoto-shi JP |
