Infrared Detection Element, Infrared Detection Module, and Manufacturing Method Therefor

摘要

In an infrared detection element 15, a first substrate 36 is bonded to a front side of a pyroelectric substrate 20. Since the thermal expansion coefficient of the first substrate 36 is lower than that of the pyroelectric substrate 20, deformation of the pyroelectric substrate 20 due to thermal expansion can be suppressed by the first substrate 36. Further, since a thermal expansion coefficient difference D is 8.9 ppm/K or less, the thermal expansion coefficient between the first substrate 36 and the pyroelectric substrate 20 is not excessively large, and this can suppress deformation of the infrared detection element 15 due to the thermal expansion coefficient difference between the first substrate 36 and the pyroelectric substrate 20.

主权项

1. An infrared detection element comprising:
a pyroelectric substrate; a front-side electrode provided on a front side of the pyroelectric substrate; a back-side electrode provided on a back side of the pyroelectric substrate to be opposed to the front-side electrode; and a first substrate bonded to the front side of the pyroelectric substrate and having a thermal expansion coefficient lower than a thermal expansion coefficient of the pyroelectric substrate, wherein the first substrate has a cavity opposed to the front-side electrode, and a thermal expansion coefficient difference D obtained by subtracting the thermal expansion coefficient of the first substrate from the thermal expansion coefficient of the pyroelectric substrate is 8.9 ppm/K or less.