METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE

摘要

This method for manufacturing a power-module substrate is provided with the following steps: a lamination step in which a ceramic member (11) and a copper member (12) are laminated together with an active-metal material and a filler material interposed therebetween, the melting point of said filler material being less than or equal to 710°C; and a heat-treatment step in which the laminated ceramic member (11) and copper member (12) are heat-treated.