PROCESS FOR FORMING SELF-ASSEMBLED MONOLAYER ON METAL SURFACE AND PRINTED CIRCUIT BOARD COMPRISING SELF-ASSEMBLED MONOLAYER

摘要

The present invention provides a printed circuit board comprising a metal surface, such as a final finish, that has been coated with a self-assembled monolayer. The self-assembled monolayer forms a coating on the metal surface that is resistant to corrosion, thus preserving the solderability of the metal surface. The present invention also provides a solution of an alkanethiol and a non-organic solvent that can be used for forming a self-assembled monolayer on a metal substrate. The present invention also provides a process for depositing a self- assembled monolayer on a metal substrate by applying a solution of an alkanethiol and a non- organic solvent to a metal substrate, such as a surface of a printed circuit board.