发明名称 ETCHED SILICON STRUCTURES, METHOD OF FORMING ETCHED SILICON STRUCTURES AND USES THEREOF
摘要 A method of etching silicon, the method comprising the steps of: electrolessly depositing a first metal onto a silicon surface to be etched, wherein the electrolessly deposited first metal partially covers the surface of the silicon to be etched; depositing a second metal that is different from the first metal over the silicon surface and the electrolessly deposited first metal, wherein a film of the deposited second metal covers the silicon surface to be etched; removing the first metal and the second metal from regions of the film of the deposited second metal that overlie the first metal to leave the second metal partially covering the silicon surface to be etched; and etching the silicon by exposing the silicon surface to an aqueous etching composition comprising an oxidant and a source of fluoride ions.
申请公布号 KR20140113929(A) 申请公布日期 2014.09.25
申请号 KR20147018405 申请日期 2012.12.21
申请人 NEXEON LTD. 发明人 LIU FENGMING;JIANG YUXIONG;GREEN MINO
分类号 C23C28/02;C23C18/16;C23C18/31;C23F1/14 主分类号 C23C28/02
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