发明名称 SUBSTRATE REINFORCING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a substrate reinforcement structure for preventing and suppressing deformation or the like of a substrate to which a socket for electrical components is fixed.SOLUTION: A frame-like first reinforcing plate 31 is mounted on a rear surface of a wiring board 10 with a first insulation sheet 34 interposed therebetween. Further, a plate-like second reinforcing plate 32 is mounted on the rear side of the first reinforcing plate 31. A spacer 33 is mounted on the second reinforcing plate 32 to be abutted to a portion of the wiring substrate 10 where a contact pin 20 does not protrude. Moreover, a second insulation sheet 35 is mounted on the second reinforcing plate 32. The first reinforcing plate 31 and the spacer 33 make it possible to prevent and suppress the deformation of the wiring substrate 10 even when the contact pin 20 and a solder protrude to the rear surface of the wiring substrate 10.
申请公布号 JP2014179524(A) 申请公布日期 2014.09.25
申请号 JP20130053610 申请日期 2013.03.15
申请人 ENPLAS CORP 发明人 KAMIYAMA TAKEO
分类号 H05K1/02;H01R33/76;H05K1/18 主分类号 H05K1/02
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