| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in heat resistance and toughness of a cured product, a sealing material using the curable resin composition, and an electronic device product using the sealing material.SOLUTION: There are provided: the curable resin composition containing a main agent and a curing agent; a sealing material 11 made of a cured product obtained by curing the curable resin composition; and an electronic device product 1 using the sealing material 11. The curable resin composition contains as the main agent a maleimide compound having two or more maleimide groups in the molecule and contains as the curing agent a diamine compound represented by general formula (1). (In the formula, A is an oxygen atom or a sulfur atom; X is a hydrogen atom, an alkyl group having 6 or less carbon atoms, or an aryl group; and n is a natural number of 1-10.)</p> |
