发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR INCORPORATING BOARD AND PRINTED CIRCUIT BOARD INCORPORATING MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component incorporating a board, in which low inductance is embodied and electrical performance is enhanced.SOLUTION: A multilayer ceramic electronic component incorporating a board includes: a ceramic body 10 including a dielectric layer 11, and having first and second principal surfaces S1, S2, first and second side faces S5, S6 facing each other, and first and second end faces S3, S4; a first internal electrode 21 and a second internal electrode 22 expose alternately to the first side face S5 or the second side face S6, alternately; and a first external electrode 31 and a second external electrode 32. The first external electrode 31 includes a first metal layer 31b, the second external electrode 32 includes a second metal layer 32b, the first external electrode 31 and second external electrode 32 are formed to extend on the first and second principal surfaces of the ceramic body 10, and the width of the first external electrode 31 is different from the width of the second external electrode 32.</p>
申请公布号 JP2014179578(A) 申请公布日期 2014.09.25
申请号 JP20130143268 申请日期 2013.07.09
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 YI BYON-HWA;KIM DOO YOUNG;LEE JIN WOO;JUNG JIN MAN
分类号 H01G4/232;H01G2/06;H01G4/252;H01G4/30;H05K1/16 主分类号 H01G4/232
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