COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a component built-in wiring board capable of preventing the deterioration of reliability by preventing the remelting of solder for built-in component connection regardless of high temperature solder and a method for manufacturing the component built-in wiring board.SOLUTION: The component built-in wiring board comprises: an insulating layer having a first main surface and a second main surface opposite to the first main surface; a wiring pattern of copper raw materials disposed on the first main surface; a component having a terminal electrode embedded in the insulating layer so as to be mounted on the surface at a side in contact with the insulating layer of the wiring pattern; a solder part positioned in contact with a terminal electrode such that the terminal electrode of the component is electrically and mechanically connected to the wiring pattern; and a copper coating positioned so as to be interposed between the solder part and the insulating layer for coating the surface of the solder part. The manufacturing process includes a process of forming a copper plating coating on the surface of the solder by using a copper foil to which the component is connected for an electrode.