发明名称 |
RESIN COMPOSITION AND THERMOSETTING FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting film which allows excellent bonding of an LED by heat with a metal base material, and has high reflection of visible light after the bonding.SOLUTION: A resin composition comprises an ethylene-methacrylic acid copolymer, and a titanium oxide particle coated with a coating layer comprising a zirconium oxide. |
申请公布号 |
JP2014177553(A) |
申请公布日期 |
2014.09.25 |
申请号 |
JP20130052317 |
申请日期 |
2013.03.14 |
申请人 |
SEKISUI FILM KK;IBIDEN CO LTD |
发明人 |
WADA HIROYUKI ; SENDO NAOHISA ; TSUKADA KIYOTAKA |
分类号 |
C08L23/08;C08J5/18;C08K9/02;H01L33/60 |
主分类号 |
C08L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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