发明名称 RESIN COMPOSITION AND THERMOSETTING FILM
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting film which allows excellent bonding of an LED by heat with a metal base material, and has high reflection of visible light after the bonding.SOLUTION: A resin composition comprises an ethylene-methacrylic acid copolymer, and a titanium oxide particle coated with a coating layer comprising a zirconium oxide.
申请公布号 JP2014177553(A) 申请公布日期 2014.09.25
申请号 JP20130052317 申请日期 2013.03.14
申请人 SEKISUI FILM KK;IBIDEN CO LTD 发明人 WADA HIROYUKI ; SENDO NAOHISA ; TSUKADA KIYOTAKA
分类号 C08L23/08;C08J5/18;C08K9/02;H01L33/60 主分类号 C08L23/08
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