发明名称 SEMICONDUCTOR DEVICE
摘要 An electrode (3) is bonded to a wiring substrate (2). A nut box (7) is inserted into a folded section (5) of the electrode (3) such that a nut (6) is aligned with an opening (4) in the electrode (3). A case (8) covers the wiring substrate (2). The nut box (7) and the case (8) are separate members. The nut box (7) is fixed to the electrode (3) so as to not fall out of the folded section (5).
申请公布号 WO2014147787(A1) 申请公布日期 2014.09.25
申请号 WO2013JP58048 申请日期 2013.03.21
申请人 MITSUBISHI ELECTRIC CORPORATION;YASUTOMI, GORO;HAYASHIDA, YUKIMASA;DATE, RYUTARO 发明人 YASUTOMI, GORO;HAYASHIDA, YUKIMASA;DATE, RYUTARO
分类号 H01L25/07;H01L23/48;H01L25/18 主分类号 H01L25/07
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