| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thermosetting silicone resin composition providing a cured product excellent in adhesiveness to a base plate plated by palladium or silver, and further to provide a semiconductor device encapsulating a photodetector semiconductor element using the resin composition.SOLUTION: There is provided a thermosetting silicone resin composition containing (A) thermosetting organopolysiloxane, (B) an inorganic filler, excluding a white pigment, (C) a curing catalyst, and (D) a silane coupling agent represented by the general formula (1). In the formula (1), Rand Rare each independently an alkoxy group or an alkyl group having 1 to 4 carbon atoms, but at least one group represented by Rand Ris an alkoxy group, Rand Rare each independently a hydrogen atom or a monovalent hydrocarbon group having 1 to 8 carbon atoms, x is the number of 1 to 6 as average number, and m and n are each independently an integer of 0 to 6.</p> |
