发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring board which surely protects a wiring conductor with a fine and strong dam portion formed on the outermost layer of a laminated body, and is excellent in connection reliability with a semiconductor chip.SOLUTION: A laminated body 31 constituting a wiring board 10 includes a plurality of connection terminal portions 41, and a wiring conductor 62, which function as conductor layers 24 on the outermost layer. The wiring conductor 62 is disposed pass through between the plurality of connection terminal portions 41 for flip-chip mounting a semiconductor chip 51. A resin insulating layer 23 on the outermost layer of the laminated body has a dam portion 63 and a reinforcement portion 64. The dam portion 63 covers the wiring conductor 62. The reinforcement portion 64 is formed between the wiring conductor 62 and the connection terminal portions 41 adjacent to the wiring conductor 62 so as to be lower than a height H3 of the dam portion 63. The reinforcement portion 64 is connected to the side face of the dam portion 63. A curvature of a corner of an upper edge site 63a of the dam portion 63 is larger than a curvature of a corner of a connection site 63b between the dam portion 63 and the reinforcement portion 64.</p>
申请公布号 JP2014179659(A) 申请公布日期 2014.09.25
申请号 JP20140124834 申请日期 2014.06.17
申请人 NGK SPARK PLUG CO LTD 发明人 HAYASHI TAKAHIRO;NAGAI MAKOTO;ITO TATSUYA;MORI SEIJI;WAKAZONO MAKOTO;NISHIDA TOMOHIRO
分类号 H01L23/12;H01L21/60;H05K3/28;H05K3/34 主分类号 H01L23/12
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