| 发明名称 |
METHOD OF CUTTING A TEMPERED GLASS SUBSTRATE |
| 摘要 |
A method of cutting a tempered glass substrate, which is capable of cut a tempered glass substrate without mechanical breaking process and cooling process , is disclosed. The method of cutting a tempered glass substrate, includes, forming an initial crack at a cut-starting point of the tempered glass substrate; forming a heated line at the tempered glass substrate by irradiating laser beam from a point different from the cut-starting point with the initial crack to the cut-starting point with the initial crack through optical heater; and automatically propagating the intimal crack along the heated line to cut the tempered glass substrate. |
| 申请公布号 |
US2014284366(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201213991770 |
申请日期 |
2012.04.03 |
| 申请人 |
RORZE SYSTEMS CORPORATION |
发明人 |
Cho Yong-Heum;Park Hyuk;Moon Seong-Wook;You Ki-Yong |
| 分类号 |
C03B33/09 |
主分类号 |
C03B33/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of a cutting tempered glass substrate, comprising:
forming an initial crack at a cut-starting point of the tempered glass substrate; forming a heated line at the tempered glass substrate by irradiating laser beam from a point different from the cut-starting point with the initial crack to the cut-starting point with the initial crack through optical heater; and automatically propagating the intimal crack along the heated line to cut the tempered glass substrate. |
| 地址 |
Yongin-si, Gyeonggi-do KR |
