HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

摘要

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

主权项

1. A cooling system for a semiconductor package comprising:
a heat spreading layer partially encased in a supporting frame, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer; and a heat generating element thermally connected to the centrally exposed bottom portion of the heat spreading layer.