发明名称 FLOORING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a flooring material capable of being attached and detached, which hardly generates warping, peeling or breaking due to moisture or heat.SOLUTION: A flooring material 1 is constituted of inorganic board. In the inorganic board of a span of 600 mm, the maximum breaking deflection amount is greater than 10 mm, and the Asker hardness of the surface is greater than 80. The inorganic board is manufactured by the following process: a cement material 41 containing reinforcing fibers mixed therewith is pressed to form a plate of a predetermined thickness; water 61 of an amount required for hardening the cement material 41 is supplied; and after being supplied with the water, the plate of the cement material is subjected to a steam treatment under a high temperature and high pressure. The inorganic board is applied with an olefin decorative sheet bonded on the surface thereof.
申请公布号 JP2014177813(A) 申请公布日期 2014.09.25
申请号 JP20130052307 申请日期 2013.03.14
申请人 PANASONIC CORP;KMEW CO LTD 发明人 SUZUKI SHINICHI;WATANABE HIROSHI
分类号 E04F15/08;C04B16/02;C04B28/02;C04B41/62 主分类号 E04F15/08
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