SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which balances compactification of the semiconductor device with improvement in reliability of the semiconductor device and has a high output.SOLUTION: A semiconductor device 100 comprises: a circuit board 2 on which a semiconductor element 1 is mounted; a base plate 4 on which the circuit board is mounted; and a resin housing 6 which encapsulates the components such as the semiconductor element 1, the circuit board 2 and the base plate 4, and which has a first surface and an opposed second surface. The resin housing has a through hole 6a and a cylindrical member 10 inside which is composed of a material having rigidity higher than that of a material composing the resin housing. A rear face of the base plate is exposed on the first surface of the resin housing. One end of the cylindrical member is exposed on the second surface of the resin housing.