发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
摘要 A method of manufacturing a semiconductor device includes forming a thin film containing a predetermined element, boron, carbon, and nitrogen and having a borazine ring skeleton on a substrate by performing a cycle a predetermined number of times. The cycle includes supplying a first precursor gas containing the predetermined element and a halogen group to the substrate; supplying a second precursor gas containing the predetermined element and an amino group to the substrate; supplying a reaction gas including an organic borazine compound to the substrate; and supplying a carbon-containing gas to the substrate. In addition, the cycle is performed under a condition in which the borazine ring skeleton in the organic borazine compound is maintained.
申请公布号 US2014287597(A1) 申请公布日期 2014.09.25
申请号 US201414219414 申请日期 2014.03.19
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 HIROSE Yoshiro;YAMAMOTO Ryuji;SANO Atsushi
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, comprising forming a thin film containing a predetermined element, boron, carbon, and nitrogen and having a borazine ring skeleton on a substrate by performing a cycle a first predetermined number of times, the cycle comprising: supplying a first precursor gas containing the predetermined element and a halogen group to the substrate; supplying a second precursor gas containing the predetermined element and an amino group to the substrate; supplying a reaction gas including an organic borazine compound to the substrate; and supplying a carbon-containing gas to the substrate wherein the cycle is performed under a condition in which the borazine ring skeleton in the organic borazine compound is maintained.
地址 Tokyo JP