| 发明名称 |
RESIN COMPOSITION, PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
A resin composition contains: (A) 100 parts by weight of the cyanate ester resin; (B) 5 to 80 parts by weight of the styrene-maleic anhydride copolymer; (C) 15 to 80 parts by weight of the styrene-butadiene-divinyl benzene (SBDVB) terpolymer; and (D) 5 to 60 parts by weight of the acrylate compound, where the contents of the styrene-maleic anhydride copolymer, the styrene butadiene divinyl benzene terpolymer, and the acrylate compound are based on 100 parts by weight of the cyanate ester resin. By providing such formulation, the resin composition of the present invention exhibits low dielectric constant, low dielectric dissipation, high thermal stability and high flame resistance, and is useful in manufacturing a prepreg or a resin film, and is further useful in manufacturing a laminate and a printed circuit board. |
| 申请公布号 |
US2014288240(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201314107585 |
申请日期 |
2013.12.16 |
| 申请人 |
Elite Materials Co., Ltd. |
发明人 |
HSIEH Chen-Yu |
| 分类号 |
C08L79/00;H05K1/03 |
主分类号 |
C08L79/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition, comprising:
100 parts by weight of the cyanate ester resin; 5 to 80 parts by weight of the styrene-maleic anhydride copolymer; 15 to 80 parts by weight of the styrene-butadiene-divinyl benzene (SBDVB) terpolymer; and 5 to 60 parts by weight of the acrylate compound, wherein the contents of the styrene-maleic anhydride copolymer, the SBDVB terpolymer and the acrylate compound are based on 100 parts by weight of the cyanate ester resin. |
| 地址 |
Guanyin Township TW |
