LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.

主权项

1. A light emitting diode package,. comprising:
a package body comprising a cavity and an air discharge channel connected to the cavity; a light emitting diode disposed in the cavity; a transparent member covering an upper side of the cavity; a bonding agent disposed between the transparent member and the package body; and a sealing material disposed in the air discharge channel and blocking the air discharge channel, wherein the cavity comprises a closed space.