| 发明名称 |
LIGHT-EMISSION ELEMENT ASSEMBLY AND METHOD OF MANUFACTURING SAME, AS WELL AS DISPLAY |
| 摘要 |
A light-emission element assembly includes: a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided. |
| 申请公布号 |
US2014284634(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201414223263 |
申请日期 |
2014.03.24 |
| 申请人 |
SONY CORPORATION |
发明人 |
Hirao Naoki;Hosono Hiroyuki |
| 分类号 |
H01L33/48;H01L27/15 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emission element assembly comprising:
a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided. |
| 地址 |
Tokyo JP |
