PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT

摘要

To achieve a package-on-package having an advantageously reduced height, a first package substrate (200,700) has a window sized (215,715) to receive a second package die (305,715). The first package substrate (200,700) interconnects to the second package substrate (110) through a plurality of package-to-package interconnects (400) such that the first and second substrates are separated by a gap. The second package die has a thickness greater than the gap such that the second package die is at least partially disposed within the first package substrate's window.