发明名称 |
MANUFACTURING METHOD OF LIQUID EJECTING HEAD |
摘要 |
A piezoelectric actuator which is provided on the flow path formation substrate, and a protection substrate which is bonded to the flow path formation substrate on the piezoelectric actuator side, the method including: bonding the flow path formation substrate on which the piezoelectric actuator is formed, and the protection substrate to form a bonded body; bonding a sealing member to the protection substrate of the bonded body on the surface side opposite the flow path formation substrate, and disposing a protection material containing a nitro compound in a space between the sealing member and the protection substrate. |
申请公布号 |
US2014284305(A1) |
申请公布日期 |
2014.09.25 |
申请号 |
US201414204583 |
申请日期 |
2014.03.11 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
ASADA Koji |
分类号 |
B41J2/16 |
主分类号 |
B41J2/16 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method of a liquid ejecting head including a flow path formation substrate on which a pressure generation chamber communicating with nozzle openings for ejecting liquid is formed, a piezoelectric actuator which is provided on the flow path formation substrate, and a protection substrate which is bonded to the flow path formation substrate on the piezoelectric actuator side, the method comprising:
bonding the flow path formation substrate on which the piezoelectric actuator is formed, and the protection substrate to form a bonded body; bonding a sealing member to the protection substrate of the bonded body on the surface side opposite the flow path formation substrate, and disposing a protection material containing a nitro compound in a space between the sealing member and the protection substrate; and performing wet etching of the flow path formation substrate of the bonded body to which the sealing member is bonded, to form the pressure generation chamber. |
地址 |
Tokyo JP |