METHOD FOR FABRICATING NEGATIVE PHOTORESIST ETCHED PITS AND TRENCHES AS CONTROLLED OPTICAL PATH AND A DEVICE FABRICATED THEREBY

摘要

This invention overcomes the challenge of finding and applying a suitable underfill material in an optical engine by filling the gap between a substrate-mounted optical device (such as a VCSEL/PIN) and a fiber (212) transmitting light to/receiving light from the optical device. The air gap is filled with SU-8 Negative Photoresist (or any material with the same functional and optical characteristics) via spin coating during the wafer processing portion of the engine assembly. The SU-8 material can be used to fill only the area around a 45 degree mirror (i.e., the pit (313)) or can be deployed both in the pit (313) and part of the fiber trench (315).