SEMICONDUCTOR DEVICE DIE ATTACHMENT

摘要

A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support.

主权项

1. A semiconductor device, comprising:
a semiconductor die having an active face presenting electrical contact elements and a back face opposite said active face; an electrically conductive die support having a first die bonding area; a layer of electrically insulating material applied to said first die bonding area of said die support; and a layer of electrically insulating adhesive die bonding material that attaches said back face of said semiconductor die to said first die bonding area of said die support through said layer of electrically insulating material.