发明名称 SILVER-PLATED MATERIAL
摘要 Provided is a silver-plated material with excellent bending workability which comprises a foundation layer consisting of nickel and formed on a base material and which comprises a surface layer consisting of silver and formed on the surface of said foundation layer. In this silver-plated material which comprises a foundation layer consisting of nickel and formed on the base material consisting of copper or a copper alloy and which comprises a 10μm or thinner surface layer consisting of silver and formed on the surface of said foundation layer, the thickness of the foundation layer is set to 2μm or less, and preferably to 1.5μm or less, and the area fraction of the {200} orientation of the surface layer is set to 15% or greater, and preferably to 25% or greater.
申请公布号 WO2014148201(A1) 申请公布日期 2014.09.25
申请号 WO2014JP54253 申请日期 2014.02.18
申请人 DOWA METALTECH CO., LTD. 发明人 SHINOHARA, KEISUKE;OGATA, MASAFUMI;MIYAZAWA, HIROSHI;SUGAWARA, AKIRA
分类号 C25D5/12;C25D3/46;C25D7/00;H01H1/04;H01R13/03 主分类号 C25D5/12
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