POWER OVERLAY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a power overlay (POL) packaging structure having an improved thermal interface.SOLUTION: A power overlay (POL) sub-module of a POL structure contains a dielectric layer, and a semiconductor device having an upper surface attached to the dielectric layer. At least one contact pad is formed on the upper surface of the semiconductor device. The POL sub-module also contains a metal wiring structure extending through the dielectric layer and electrically coupled to at least one contact pad of the semiconductor device. A conductive shim is coupled to a bottom surface of the semiconductor device, and the conductive shim is coupled to a first side of a thermal interface. A heat sink is coupled to a second side of an electrical insulation thermal interface.