| 发明名称 |
CASING OF ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided. |
| 申请公布号 |
US2014284096(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201414183534 |
申请日期 |
2014.02.19 |
| 申请人 |
HTC Corporation |
发明人 |
Wu Tim Chung-Ting;Chuang Cheng-Chieh;Lu Chi-Jen;Chu Chun-Lung;Lin Chien-Hung |
| 分类号 |
H05K5/04 |
主分类号 |
H05K5/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a casing of an electronic device, comprising:
providing a metallic housing, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface; forming a plurality of apertures on the inner surface of the metallic housing; forming a non-conductive layer on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures; and dyeing the outer surface of the metallic housing to form the casing of the electronic device. |
| 地址 |
Taoyuan County TW |
