ULTRASONIC BONDING APPARATUS

摘要

According to one embodiment, an ultrasonic bonding apparatus includes an ultrasonic transducer, a distal-end tool, an ultrasonic horn and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and a control device. The ultrasonic oscillator applies the voltage oscillated by the oscillation circuit to the ultrasonic transducer. The control device is configured to detect a voltage reflection ratio from the voltage and current supplied from the oscillation circuit and to control the frequency of the voltage generated by the oscillation circuit, thereby to minimize the voltage reflection ratio.

主权项

1. An ultrasonic bonding apparatus comprising:
an ultrasonic transducer configured to generate ultrasonic vibration as the ultrasonic transducer receives a voltage; a distal-end tool configured to apply a pressure and the ultrasonic vibration to work pieces to be bonded together; an ultrasonic horn configured to transmit the pressure and the ultrasonic vibration from the ultrasonic transducer to the distal-end tool; and an ultrasonic oscillator comprising an oscillation circuit and a control device, the ultrasonic oscillator applying the voltage oscillated by the oscillation circuit to the ultrasonic transducer; and the control device configured to detect a voltage reflection ratio from the voltage and current supplied from the oscillation circuit and to control the frequency of the voltage generated by the oscillation circuit, thereby to minimize the voltage reflection ratio.