发明名称 |
SELF-FORMATION OF HIGH-DENSITY ARRAYS OF NANOSTRUCTURES |
摘要 |
A method for forming nanostructures includes bonding a flexible substrate to a crystalline semiconductor layer having a two-dimensional material formed on a side opposite the flexible substrate. The crystalline semiconductor layer is stressed in a first direction to initiate first cracks in the crystalline semiconductor layer. The first cracks are propagated through the crystalline semiconductor layer and through the two-dimensional material. The stress of the crystalline semiconductor layer is released to provide parallel structures including the two-dimensional material on the crystalline semiconductor layer. |
申请公布号 |
US2014284616(A1) |
申请公布日期 |
2014.09.25 |
申请号 |
US201313967174 |
申请日期 |
2013.08.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Dimitrakopoulos Christos D.;Kim Jeehwan;Park Hongsik;Shin Byungha |
分类号 |
H01L29/32;H01L29/16 |
主分类号 |
H01L29/32 |
代理机构 |
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代理人 |
|
主权项 |
1. A semiconductor device, comprising:
a flexible substrate; a crystalline semiconductor layer bonded to the flexible substrate, the crystalline semiconductor layer being cracked to form parallel structures along at least one direction; and a two-dimensional material formed on the crystalline semiconductor layer having a thickness of one to ten monolayers, the two-dimensional material being separated at cracks in the crystalline semiconductor layer to form nanostructures. |
地址 |
Armonk NY US |