HEAT-SINK STRUCTURE, SEMICONDUCTOR DEVICE, AND HEAT-SINK MOUNTING METHOD

摘要

[Problem] In an electronic device that contains a plurality of heat-generating components, heat-generating components having differing heights cannot all be provided with heat-dissipation capability simultaneously. [Solution] This heat-sink structure comprises the following: a first heat sink; a second heat sink that has a protrusion at the bottom of a side surface thereof; a thermally conductive substance sandwiched between a side surface of the first heat sink and the aforementioned side surface of the second heat sink; and a flexible cushioning material sandwiched between the base of the first heat sink and the top surface of the aforementioned protrusion.