发明名称 FILM FORMING METHOD USING EPITAXIAL GROWTH AND EPITAXIAL GROWTH APPARATUS
摘要 When a reaction chamber defined and formed by a ceiling plate as a top face, a substrate mounting portion as a bottom face, and a side wall as a lateral face is constructed, the ceiling plate is supported by a support at the circumferential edge of the ceiling plate from the upper side and the outer side of the circumferential edge, and the reactant gas is rectified in a reactant gas supply path disposed in the side wall so that a horizontal component in a flow direction of the reactant gas in the reaction chamber corresponds to a horizontal component in a direction extending from the center of an opening of the reactant gas supply path facing the reaction chamber to the center of the reaction chamber.
申请公布号 WO2014151867(A1) 申请公布日期 2014.09.25
申请号 WO2014US26589 申请日期 2014.03.13
申请人 APPLIED MATERIALS, INC. 发明人 OKABE, AKIRA;MORI, YOSHINOBU
分类号 H01L21/20;H01L21/02;H01L21/324 主分类号 H01L21/20
代理机构 代理人
主权项
地址