| 摘要 |
PROBLEM TO BE SOLVED: To provide a recipe selection method and a die bonder capable of easily and quickly performing recipe selection with little error while an operator used to view a type name and type data (recipe) to determine which recipe is used in type change in conventional recipe selection, causing the requirement of time and labor and the highly probable occurrence of an error.SOLUTION: The recipe selection method comprises: a die size measurement step of measuring the die size of a wafer supplied to the pickup device of a wafer supply part; a type candidate selection step of selecting a type candidate from the measured die size; a die image acquisition step of imaging the die surface of the wafer to acquire a die image; an image matching step of comparing the acquired image with a stored image by image matching; and a product type selection step of, when the image matching is performed by the image matching step, selecting the type subjected to image matching. |
