| 主权项 |
1. A semiconductor memory device, comprising:
a memory device configured having memory cells arranged therein; a data output buffer for outputting data read from the memory device, and a data input buffer for receiving data to be written to the memory device; a plurality of input/output pads to which the data input buffer and the data output buffer for inputting/outputting the data are respectively connected; a plurality of on-die termination circuits each connected to any one of the plurality of input/output pads; and a control circuit operative to control the on-die termination circuits, the plurality of on-die termination circuits each comprising: a pull-up element connected between a first terminal and an output terminal; and a pull-down element connected between the output terminal and a second terminal, the pull-up element being driven by a first pull-up element driver, the pull-down element being driven by a first pull-down element driver, and the control circuit being operative to activate a plurality of the on-die termination circuits at different timings. |
