发明名称 Connection Structure of Wiring Cable and Connection Method of Wiring Cable
摘要 To provide a connection structure of a wiring cable and a connection method of a wiring cable which enable the downsizing of a head part. The connection structure includes: a semiconductor chip having a plurality of imaging elements formed on a front surface and a plurality of connection pads formed on a rear surface; and a wiring cable in which a plurality of wires are integrally formed and from whose end surface the plural wires are exposed, wherein the plural connection pads of the semiconductor chip and the plural wires exposed from the end surface are connected.
申请公布号 US2014284751(A1) 申请公布日期 2014.09.25
申请号 US201414179414 申请日期 2014.02.12
申请人 Kabushiki Kaisha Toshiba 发明人 Kamei Takatoshi
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项 1. A connection structure of a wiring cable, comprising: a semiconductor chip having a plurality of imaging elements formed on a front surface thereof and a plurality of connection pads formed on a rear surface thereof; and a wiring cable integrally formed from a plurality of wires, the plurality of wires being exposed on an end surface of the wiring cable, the plurality of wires exposed on the end surface being connected with the plurality of connection pads of the semiconductor chip.
地址 Tokyo JP