PACKAGING FOR AN ELECTRONIC CIRCUIT

摘要

In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations (230) on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead is located at a respective end of the curved component.