| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation substrate including an insulating layer formed by aerosol deposition (AD) method, that exhibits high heat dissipation while maintaining high withstand voltage and high adhesion sufficiently.SOLUTION: A ceramic insulation layer having high thermal conductivity by exhibiting the original thermal conductivity of an insulating material composing the insulation layer, while maintaining high withstand voltage and high adhesion sufficiently, is obtained by subjecting a ceramic insulating layer formed by AD method at a temperature near the room temperature to annealing for heating in an appropriate temperature range. |
