| 发明名称 |
Coupler to Launch Electromagnetic Signal from Microstrip to Dielectric Waveguide |
| 摘要 |
A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line. |
| 申请公布号 |
US2014285281(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201313854947 |
申请日期 |
2013.04.01 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Herbsommer Juan Alejandro;Payne Robert Floyd;Schuppener Gerd;Haroun Baher |
| 分类号 |
H01P5/107 |
主分类号 |
H01P5/107 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system comprising:
a multilayer substrate for mounting an integrated circuit; a microstrip line formed in one of the layers of the multilayer substrate, wherein the microstrip line is formed parallel to a ground plane element that is located in another one of the layers of the multilayer substrate; and a metallic waveguide mounted on the multilayer substrate, wherein the metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate, wherein a pinnacle of the tapered end is coupled to the ground plane element, and wherein the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line. |
| 地址 |
US |
