| 摘要 |
<p>Provided is an adhering apparatus for adhering an electronic component using a resin sheet. The adhering apparatus is provided with: a first mold member having a first cavity capable of housing an adhesion preparation body that is provided with the electronic component, and the resin sheet disposed to face the electronic component with a space therebetween; an elastic member that is disposed to face the resin sheet such that the elastic member can form a first enclosed space with the first cavity; and a pressure difference generating means, which is connected to the first mold member, and which makes atmospheric pressure in the first enclosed space lower than that of a space on the opposite side to the first enclosed space with respect to the elastic member. The adhering apparatus is configured such that the elastic member moves to the first cavity side by means of operations of the pressure difference generating means, and consequently, the adhesion preparation body is pressed to the direction in which the electronic component and the resin sheet are facing each other, and the electronic component is adhered using the resin sheet.</p> |
