发明名称 MAGNETIC COMPONENT ASSEMBLY WITH FILLED PHYSICAL GAP
摘要 <p>Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.</p>
申请公布号 WO2014150934(A1) 申请公布日期 2014.09.25
申请号 WO2014US24588 申请日期 2014.03.12
申请人 COOPER TECHNOLOGIES COMPANY 发明人 KRISHNAMOORTHY, AHILA;BOGERT, ROBERT JAMES;YAN, YIPENG
分类号 H01F3/10;H01F3/14;H01F17/04;H01F27/255;H01F27/28;H01F27/29;H01F27/30 主分类号 H01F3/10
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