发明名称 |
MAGNETIC COMPONENT ASSEMBLY WITH FILLED PHYSICAL GAP |
摘要 |
<p>Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.</p> |
申请公布号 |
WO2014150934(A1) |
申请公布日期 |
2014.09.25 |
申请号 |
WO2014US24588 |
申请日期 |
2014.03.12 |
申请人 |
COOPER TECHNOLOGIES COMPANY |
发明人 |
KRISHNAMOORTHY, AHILA;BOGERT, ROBERT JAMES;YAN, YIPENG |
分类号 |
H01F3/10;H01F3/14;H01F17/04;H01F27/255;H01F27/28;H01F27/29;H01F27/30 |
主分类号 |
H01F3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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