发明名称 |
CIRCUIT AND METHOD OF ON-DIE TERMINATION, SEMICONDUCTOR DEVICE INCLUDING THE SAME |
摘要 |
Disclosed are an on-die termination circuit which changes an offset code of a ZQ calibration circuit in response to a ZQ calibration result value, and a semiconductor device including the same. The on-die termination (ODT) circuit includes: a calibration unit, an offset-code generating unit, an adder, and an ODT unit. The calibration unit generates a pull-up code and a pull-down code. The offset code generates a pull-up offset code and a pull-down offset code based on a mode-register-set signal, the pull-up code, and the pull-down code. The adder adds the pull-up offset code and the pull-down offset code to the pull-up code and the pull-down code, respectively, and generates a pull-up calibration code and a pull-down calibration code. The ODT unit changes ODT resistance in response to the pull-up calibration code and the pull-down calibration code. |
申请公布号 |
KR20140113782(A) |
申请公布日期 |
2014.09.25 |
申请号 |
KR20130026947 |
申请日期 |
2013.03.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SEOL, HO SEOK;BAE, SEUNG JUN;SOHN, YOUNG SOO;SONG, HO SUNG |
分类号 |
G11C7/10 |
主分类号 |
G11C7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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