| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide, at low cost, a multilayer wiring board which improves connection reliability while maintaining wide-range applicability of electronic components and is capable of attaining density increase and functionality improvement, and a component mounting multilayer wiring board employing the multilayer wiring board.SOLUTION: The multilayer wiring board comprises: a plurality of wiring layers; a plurality of insulation layers each disposed to electrically separate the plurality of wiring layers; and an inter-layer connection body for electrically connecting the plurality of wiring layers. A wiring layer positioned on a top face of the plurality of wiring layers includes a plurality of electrode lands, conductive posts are disposed on the plurality of lands, and a solder layer is disposed on a top face of the conductive posts.</p> |
