MINIMIZING PRINTED CIRCUIT BOARD WARPAGE

摘要

A printed circuit board and method of manufacturing same, the printed circuit board comprising a stack of layers. The stack of layers being comprised of alternating circuit layers and insulating layers that are laminated together. The stack of layers includes an area with resin cured to a degree. The area has a coefficient of thermal expansion that is dependent, at least in part, on the degree of curing of the resin.

主权项

1. A method of fabricating an asymmetric printed circuit board with minimized warpage, the method comprising:
creating a stack of layers, wherein the stack of layers includes a top layer and a bottom layer; identifying, in the stack of layers, an area that includes resin; and applying one or both of electromagnetic radiation and pressure to the identified area that includes resin, thereby increasing the degree of curing of at least a portion of the resin included in the identified area.