| 发明名称 |
CIRCUIT BOARD FOR CONNECTING SECONDARY BATTERY |
| 摘要 |
A circuit board for connecting a secondary battery including a first insulation layer, a conductive layer positioned on one surface of the first insulation layer, and a pad layer positioned on the conductive layer and divided into at least two areas is disclosed. In the circuit board, the conductive layer has an area wider than that of the pad layer. Accordingly, the conductive layer has an area wider than that of the pad layer, so that it is possible to miniaturize the circuit board and to improve the safety of the circuit board. |
| 申请公布号 |
US2014285990(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201414225098 |
申请日期 |
2014.03.25 |
| 申请人 |
Samsung SDI Co., Ltd. |
发明人 |
Kim Hyung-Sin;Choi Ji-Yeon;Lee Seok-Bong;Lee Sang-Joo |
| 分类号 |
H01M2/10;H05K1/18 |
主分类号 |
H01M2/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board for connecting a secondary battery, comprising:
a first insulation layer; a conductive layer positioned on one surface of the first insulation layer; and a pad layer positioned on the conductive layer and divided into at least two areas, wherein the conductive layer has an area wider than that of the pad layer. |
| 地址 |
Yongin-si KR |
